パッケージ/ボード設計工数短縮ツール
Simplify Design Automationは,独自の自動配線技術をベースとした,LSIパッケージやボードのレイアウト設計効率化ソリューションを提供します。
<Technology>
· Integration of 3-generation automatic wiring algorithm into single tool
Gridded ~ Shape-based ~ Topology-based
· High wire connection rate
· "Ultra" high speed processing
· Covers 2 steps of planning and detailed wiring
· High throughput design iteration / workflow realized
<Purpose / Usage>
· Practical [= High precision / quick] Design feasibility
Study / Assessment
· LPB (LSI ~ Package ~ Board) Increase efficiency of cooperative design process, shorten period
<Main functions>
· Arbitrary angle wiring
Multilayer wiring
· Via generation
· Consideration of Power / GND
· Net Assign / Pin Swap
· Differential pair
· Bundling (net group, bus, bank, ...)
Route control
· Concurrent design (same die / simultaneous progression of multiple package types)
SimplifyDA PKG
· Supports BGA (flip chip, wire bond)
·test case
- Number of nets: 1117
- Number of signal layers: 4
- Initial connection ratio: 100%
- Wiring time: 3 minutes
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