In recent years, a number of high-performance, multifunctional system LSIs have been developed by miniaturization of processes and development and automation of design tools. At the same time, a wide range of knowledge and high technical skill is required for test development and evaluation work of system LSI. In addition, higher cost of corresponding test systems, related equipment, jigs etc., and increase in test cost due to prolonged test development etc. have become conspicuous. In this situation, our company has comprehensive services related to the testing of system LSI.
Content of service
Testing consultant and test technology training We will consistently coordinate packaging and testing from the device evaluation that is requested by the customer.
Test program development, device evaluation and DFT test (Scan / BIST / IDDQ) Considering the test method from the customer's design stage, we promise to develop the optimum test program up to mass production test.
Device Failure Analysis / Circuit Modification Service Identify the fault location inside the device and perform a physical analysis. Also, we will disconnect and connect the wiring according to customer's instructions.
Bench Evaluation Board Production / LSI Test Fixture Production / LSI Test Board Production Operation
Software development and operation such as test data processing etc * Transmission line analysis (SI) · Grand Bounds (PI) simulation · service
Service overview
In recent years, a number of high-performance, multifunctional system LSIs have been developed by miniaturization of processes and development and automation of design tools. At the same time, a wide range of knowledge and high technical skill is required for test development and evaluation work of system LSI. In addition, higher cost of corresponding test systems, related equipment, jigs etc., and increase in test cost due to prolonged test development etc. have become conspicuous. We believe that we can propose and provide timely and reasonable test environments and solutions through comprehensive services related to system LSI testing under these circumstances.
Target test system
Advantest
T33xx Series, T66xx/T65xx Series, T2000 Series
Agilent
83000/93000 Series, 94000/949x Series
旧Ando
DIC8000/9000 Series, AL727x Series (LTX)
Credence
ASL Series, Diamond
Teradyne
J9xx Series, J750/Flex, A500 Series, Catalyst
TESEDA
V520
Yokogawa
TS6000 Series
Device failure analysis service
What is required for failure analysis is that the analysis TAT is short and the cause can be clarified. Analysis preparation point Analysis is possible by directly connecting the tester and analysis device so that device failure can be reproduced and observed at the time of analysis. In order to prepare CAD data for shortening time, we can utilize powerful navigation function and analyze efficiently. Analysis by service item purpose (prototype analysis / reentrant analysis / yield analysis) Analysis of phenomena of DC failure and function failure Analysis possible with both wafer and package Preparatory work such as package opening, opening of socket etc.
Circuit modification service by using FIB
Package opening / pre-processing work of peeling of polyimide is carried out
90 nm process, multilayer, with processing experience with Al / Cu wiring
Processing experience of the second layer from the bottom of the eight layer product
Wafer (6 - 8 inches)
Package (CSP, PFBGA, TBGA, QFP, etc.)
Back side FIB processing is also possible (processing is done from the Si side)
